Issue 1/2.2023


Dear Readers,

a truly crazy year has come to an end – I sincerely hope that you have had the best possible start into the new one! Despite all the economic, political and pandemic complications, trade fair activities in the building and furnishing sector have picked up again since last autumn: Light & Building in Frankfurt (see AIT 12.2022) was followed by Orgatec in Cologne (picture above and p. 54). You will find a comprehensive follow-up report from page 28 onwards. For the first time since the pandemic, the Architecture+ Office Innovation Award took place again as part of Orgatec – we feature all the products submitted, with the jury’s decisions for the winners and special mentions, from page 122 onwards. We would like to take this opportunity to thank the committed jury and all the participants (see picture on the right)! During the trade fair visits and the research for the current issue on “Sales and Presentation”, the question arose whether the pandemic-induced trade fair break was predestined to reflect on the future of trade fairs and possible course corrections. We want to sharpen our focus on the events still to come! Our selected interior design projects (from p. 68) focus on trade fair stand concepts that are reusable and repurposable, made of sustainable, few and homogeneous materials. In shopfitting, too, more and more designers are considering the use of recycled, degradable, highquality or already existing components, hybrid concepts and intelligent use of space. This also proves helpful in tackling a red-hot issue: our retail expert Henriette Sofia Steuer (from p. 111) deals with the potential of repurposing department stores. And even in museum concepts (from p. 114) the claim reuse, reduce and recycle can be implemented. New this year is the Campus (p. 14) heading in our Forum news section, where, (interior) architecture students will find concentrated information on competitions, scholarships, prizes and awards. We wish you and us all the best for 2023!

Best wishes
Petra Stephan, Dipl.-Ing.
Chief Editor

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